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Applicable product objects of the equipment:
cutting of SMD ceramic capacitors, inductors, MLCC,magnetic beads, resistors and other products.
Equipment main overview:
This equipment is specially designed for the cutting operation of chip components. This equipment adopts two sets of CCDs as the visual alignment imaging system, through hardware imaging and processing to judge the center point of MARK as the basis for cutting. The entire cutting mechanism is composed of the angle adjustment axis, the platform movement axis and the servo system of the cutter axis. The image system is integrated through the PC software, which greatly improves the cutting quality and efficiency, and includes the blade damage visual detection function. Product pre-positioning function before loading, and double preheating function selection before loading.
Maximum dimensions of the equipment:
about 1100mmW×1050mmD×2000mmH (including three-color lights)
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