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The market size of HTCC ceramic packaging is expected to reach 29.3 billion yuan in 2028

The market size of HTCC ceramic packaging is expected to reach 29.3 billion yuan in 2028

  • Categories:News
  • Time of issue:2022-10-25 11:20
  • Views:

(Summary description)According to QYR's statistics and forecasts, the global HTCC ceramic packaging market sales will reach 29.3 billion yuan in 2028.

The market size of HTCC ceramic packaging is expected to reach 29.3 billion yuan in 2028

(Summary description)According to QYR's statistics and forecasts, the global HTCC ceramic packaging market sales will reach 29.3 billion yuan in 2028.

  • Categories:News
  • Time of issue:2022-10-25 11:20
  • Views:
Information

China Powder Network News HTCC (High Temperature Co-fired Ceramic) refers to ceramics with electrical interconnection characteristics that are sintered together with metals with higher melting point above 1,450℃. Generally, HTCC is subjected to glue discharge treatment below 900℃, and then the laminated ceramic tiles are co-fired into a whole in a higher temperature environment of 1,500-1,800℃. HTCC circuit technology is made by screen printing, and the selected conductor materials are generally tungsten, molybdenum, manganese and other metals or precious metals with higher melting points. High-temperature co-fired ceramics have many advantages, such as high structural strength, high thermal conductivity, good chemical stability and high wiring density, because of the high sintering temperature. They are widely used in ceramic packaging, high-power ceramic substrates and other fields with high requirements for thermal stability, matrix mechanical strength and sealing performance. HTCC ceramic package is widely used in the field of high-end packaging materials because of its high dielectric properties, low loss characteristics, thermal expansion coefficient close to silicon wafer, high structural strength and other characteristics. It is widely used by radio frequency filters (SAW, BAW), radio frequency IC, optical communication modules, image sensors, uncooled focal plane thermal infrared sensors, LDMOS, CMOS, MEMS sensors and so on. This paper studies HTCC, including HTCC ceramic substrate, HTCC packaging tubes and shells and HTCC package base.

Ceramic packaging base is the packaging component of chip electronic components such as piezoelectric frequency devices, and its terminal products are widely used in smart phones, wireless communication, GPS, Bluetooth, automotive electronics and other fields. In order to realize the functions of frequency control and selection, smart terminals such as smart phones and automotive electronics need to use a large number of tuning fork crystal resonators, crystal oscillators, acoustic meter filters and other piezoelectric frequency devices. However, the new ceramic packaging base for these piezoelectric frequency devices needs to meet the requirements of miniaturization, high reliability, high precision, high mechanical strength, high flatness and other indicators, which requires higher material formula and equipment processing accuracy. At present, it is basically supplied by a few Japanese companies at a high price, which leads to the high packaging cost of domestic frequency devices, which restricts the development of domestic piezoelectric frequency device industry and terminal application fields to some extent.

The main downstream applications of ceramic package base are SMD package, RF package, image sensor package, etc. Among them, SMD package is mainly used for crystal oscillator, etc. RF packaging is mainly used for SAW filters; Image sensor packaging is mainly used in high-end markets such as 3Dsensing and CMOS image sensors.

Overall Scale Analysis of Global HTCC Ceramic Packaging Market

According to the statistics and forecast of QYR (Hengzhou Bozhi), the global sales of HTCC ceramic packaging market will reach 18 billion yuan in 2021, and it is expected to reach 29.3 billion yuan in 2028, with a compound annual growth rate (CAGR) of 6.75%(2022-2028). At the regional level, China's market has changed rapidly in the past few years. In 2021, the market size was 4.7 billion yuan, accounting for 26.2% of the world's total. It is expected to reach 9.7 billion yuan in 2028, and the global share will reach 33%.

In terms of consumption, China is currently the largest consumer market in the world, with a market share of 26.2% in 2021, followed by North America, Japan and Europe, with 17%, 16% and 15% respectively. It is expected that China will grow the fastest in the next few years.

On the production side, Japan is the largest production area, accounting for about 70% of the global market share in terms of output value. The core manufacturers are Kyocera, NGK/NTK and Maruhe. China is the second largest production area in the world, with a market share of about 24%. There are 13 core manufacturers (mainly domestic and military products), Hebei China Ceramics (civilian products), 43 manufacturers (Hefei Shengda, mainly domestic products), Yixing Electronics, Beidouxingtong (Jiali Electronics), Qingdao Kerry Electronics (mainly exported to North America and Europe), etc. In 2021, 13 institutes and Hebei China Ceramics Co., Ltd. shared about 10% of the global market share (China Ceramics Co., Ltd. shared about 3.8% and 13 institutes shared about 6.9%). In addition, in the European market, it is mainly Egide in France, and currently it is mainly RF Materials (METALLIFE) in South Korea. It is expected that in the next few years, thanks to the active domestic market environment and strong demand, China will maintain a rapid growth, and the market output value share of China will reach 32% in 2028.

From the perspective of product classification, HTCC packaging tubes and shells occupies an important position, accounting for about 77% of the market share, followed by HTCC packaging base, accounting for about 17.5%. At the same time, as far as applications are concerned, communication packaging is the largest market, accounting for about 32% of the market share, followed by aviation and military, industrial fields and consumer electronics.

From the perspective of manufacturers, globally, the core manufacturers of HTCC packaging tubes and shells are mainly Kyocera, NGK/NTK, Hebei Zhongci and 13, and the three occupy about 86% of the global market share. In terms of HTCC packaging base, the core manufacturers are mainly Kyocera and Chaozhou Sanhuan, which together account for about 85% of the market. In terms of HTCC ceramic substrates, the core manufacturers are mainly Japan's Kyocera, Maruwa and NGK/NTK monopoly, and the three occupy about 80% of the market share.

In recent years, the Chinese market has been very active, especially the two manufacturers of Chaozhou Sanhuan and Hebei Zhongci (13), whose market share has grown rapidly. In addition, Hefei Shengda, Jiangsu Yixing Electronic Device Factory Co., Ltd., Beidouxingtong (Jiali Electronics), Cijin Technology, Qingdao Kairui Electronics and Fujian Minhang Electronics also grew rapidly. Potential entrants include China Electronics Technology Group 55, Canqin Technology, Hefei Yifeng Electronic Packaging and Shanghai Xintaowei New Material Technology.

Source:China Powder Network News

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