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Automatic Slitting Machine

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Automatic Slitting Machine

This equipment is specially designed for chip component products to provide a cutting process after lamination. The equipment uses two sets of CCDs as a visual alignment and imaging system. The hardware is used to take images and process and judge the edge of the block. As the basis for cutting, the Blocks are divided into 4.
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The category: Semiconductor
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Automatic Slitting Machine


Equipment use:

This equipment is specially designed for chip component products to provide a cutting process after lamination. The equipment uses two sets of CCDs as a visual alignment and imaging system. The hardware is used to take images and process and judge the edge of the block. As the basis for cutting, the Blocks are divided into 4.

Equipment basic parameters:

Dimensions: 1800mm(L)*1200mm(W)*1800mm(H) (excluding three-color lights)

Dimensions of the block to be cut: 310mm×310mm×5mm

Bar size after slitting: 155mm±0.1mm×155mm±0.1mm

Operation mode: keyboard and mouse + 10" touch screen

Keyword:
slitting machine
electronic
automatic machine
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