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Intel CEO: Willing to OEM for AMD and NVIDIA in their own factories
- Categories:News
- Time of issue:2022-10-18 10:24
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(Summary description)
Intel CEO: Willing to OEM for AMD and NVIDIA in their own factories
- Categories:News
- Time of issue:2022-10-18 10:24
- Views:
Recently, Intel CEO Henry Kissinger revealed to the public that he is willing to manufacture CPUs and GPUs for competitors AMD and Nvidia in his own factory. He pointed out that at the groundbreaking ceremony of Intel's Ohio factory, he communicated with CEOs of some design companies and welcomed them, and even offered to put the company's logo next to the factories where new products are produced.
Intel hopes to use the new factory in Ohio to provide foundry services for chip companies, in addition to AMD and Nvidia, Intel also hopes to OEM for Qualcomm, Apple and other companies.
In recent years, these big manufacturers mainly rely on TSMC for OEM. Kissinger said that TSMC has improved its business model for 30 years, and they are good at it. They have their own ecosystem. Intel doesn't intend to replace them, but to win this business, Intel must start to enter with a unique perspective, the best transistors, PDK (Process Design Suite) and EDA (Electrical Design Automation) tools. "We are gaining a good momentum of development and are quite excited about it".
According to the data, after Kissinger became Intel CEO in February 2021, he started a drastic reform through the IDM 2.0 strategy. Under the IDM 2.0 strategy, Intel focuses on core process processes and increased capacity, while restarting the wafer foundry business, that is, the global internal factory network for large-scale manufacturing, expanding the use of third-party foundry capacity, and creating a world-class foundry business, Intel foundry services IFS.
In September this year, the Intel On Technology Innovation Summit was held. At the meeting, Intel revealed that this year, Intel foundry services (IFS) will usher in the era of "SystemFoundry", and the focus of Intel will shift from system on chip (SoC) to system in package. "System-level OEM" has four components: wafer manufacturing; Encapsulation; Software; Open Chiplet ecosystem. To help the development of foundry business, earlier this year, Intel launched a $1 billion IFS Innovation Fund to support startups and mature companies in the early stage of building disruptive technologies for foundry ecosystem.
Source: DRAMeXchange
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