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Automatic Ceramic Cutting Machine
Automatic Ceramic Cutting Machine
Applicable:
Cutting of SMD ceramic capacitors, inductors, magnetic beads, resistors and other products.
Equipment main overview:
This equipment is specially designed for the cutting operation of chip components, and its biggest features are automation, speed and safety. This equipment uses two sets of CCDs as the visual alignment imaging system, through hardware imaging and processing to judge the center point of MARK, as the basis for cutting. The entire cutting mechanism is composed of the angle adjustment axis, the platform movement axis and the servo system of the cutter axis. The image system is integrated through the PC software, which greatly improves the cutting quality and efficiency.
PARAMETER FORM
Basic parameter |
Parameter value |
Machine size |
1200mm×1100mm×2100mm (including alarm light) |
Cutting material size |
<170mm×170mm (according to customer demand) |
Machine weight |
1500KG |
Cutting speed |
0.5 seconds/knife (alignment) |
Alignment speed |
0.3 seconds/mark |
Power supply |
220BAC,single phase,50Hz,6KW |
Air pressure |
0.4-0.7MPa |
MACHINE SHOW
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