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Research status of LTCC package technology
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- Time of issue:2023-04-25 09:55
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(Summary description)Research status of LTCC package technology
Research status of LTCC package technology
- Categories:News
- Time of issue:2023-04-25 09:55
- Views:
LTCC metal case package
LTCC metal case packaging is similar to traditional thick-film multi-layer alumina substrate metal case packaging. It is a method of welding or bonding the LTCC substrate on the inner bottom surface of the metal case, and realizing the electrical connection inside and outside the case through insulators or connectors embedded in the metal case. It is usually used in high-reliability electronic products or customized military or aerospace products with special performance requirements.
The metal shell can be welded to the LTCC substrate with one-sided cavity opening, and can also be welded to the LTCC substrate with double-sided cavity opening. After the components are assembled on the LTCC substrate, the metal casing can be sealed by parallel seam welding or laser welding. The advantages of LTCC metal shell packaging are good airtightness, strong versatility, and relatively mature technology. It is one of the most widely used LTCC packaging forms.
LTCC pin grid array package
Pin Grid Array(PGA)
The LTCC Pin Grid Array(PGA) package is a package in which a metal frame is welded on the surface of the LTCC substrate as the package frame, and a metal PGA is welded on the bottom as the I/O terminal. The LTCC circuit substrate is used as the packaging carrier, and the I/O terminals of the package are directly drawn out on the substrate, so that the substrate, frame and cover are integrated into a package.
LTCC ball grid array package
The LTCC Ball Grid Array (BGA) package is a package in which the surface of the LTCC substrate is soldered with a metal frame as the package frame, and the bottom surface is soldered with solder balls as the I/O terminal. LTCC BGA hermetic package also belongs to LTCC integrated package.
The BGA package is a more efficient package with a higher I/O pin count than a perimeter-exited metal case package. PGA package pin pitch is difficult to be smaller than 1.27mm, while BGA ball pitch can be smaller, and I/O pin density will be higher than PGA package. LTCC BGA packages have very short pins and short current paths for vertical connections, and BGA packages have much lower lead inductance than other lead connections . The BGA solder balls are distributed in an area array, which is beneficial to the heat dissipation of the substrate.
LTCC QFP package
QFP package
LTCC Quad Flat Package(QFP Package) is a package in which the metal frame welded on the surface of the LTCC substrate is used as the package frame, and the leads welded on the bottom edge of the substrate are used as the I/O terminal.
LTCC LCC package
LTCC Leadless Chip Carrier(LCC) package is a packaging form in which the surface of the LTCC substrate is welded with a metal frame as the package frame, and the I/O terminal is a conductor film layer drawn from the inside of the LTCC substrate to the bottom of the substrate.
LTCC 3D-MCM package
Multichip Module(MCM)
LTCC Three-Dimensional Multichip Module (3D-MCM) package is a packaging of multi-piece (not less than 2) two-dimensional board-level LTCC module (2D-MCM) stacked vertically and realized electrical and mechanical connections to form the components.
Source: IBE Electronics
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